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半导体术语中英文对照表,芯片人必备!

时间:2019-6-24   点击次数:376

  • 半导体产业作为一个起源于国外的技术,很多相关的技术术语都是用英文表述。且由于很多从业者都有海外经历,或者他们习惯于用英文表述相关的工艺和技术节点,那就导致很多的英文术语被翻译为中文之后,很多人不能对照得上,或者不知道怎么翻译。在这里我们整理一些常用的半导体术语的中英文版本,希望对大家有所帮助。如果当中有出错,请帮忙纠正,谢谢!


    常用半导体中英对照表


    离子注入机  ion implanter


    LSS理论  Lindhand Scharff and Schiott theory,又称“林汉德-斯卡夫-斯高特理论”。


    沟道效应  channeling effect


    射程分布  range distribution


    深度分布  depth distribution


    投影射程  projected range


    阻止距离  stopping distance


    阻止本领  stopping power


    标准阻止截面  standard stopping cross section


    退火  annealing


    激活能  activation energy


    等温退火  isothermal annealing


    激光退火  laser annealing


    应力感生缺陷  stress-induced defect


    择优取向  preferred orientation


    制版工艺  mask-making technology


    图形畸变  pattern distortion


    初缩  first minification


    精缩  final minification


    母版  master mask


    铬版  chromium plate


    干版  dry plate


    乳胶版  emulsion plate


    透明版  see-through plate


    高分辨率版  high resolution plate, HRP


    超微粒干版  plate for ultra-microminiaturization


    掩模  mask


    掩模对准  mask alignment


    对准精度  alignment precision


    光刻胶  photoresist,又称“光致抗蚀剂”。


    负性光刻胶  negative photoresist


    正性光刻胶  positive photoresist


    无机光刻胶  inorganic resist


    多层光刻胶  multilevel resist


    电子束光刻胶  electron beam resist


    X射线光刻胶  X-ray resist


    刷洗  scrubbing


    甩胶  spinning


    涂胶  photoresist coating


    后烘  postbaking


    光刻  photolithography


    X射线光刻  X-ray lithography


    电子束光刻  electron beam lithography


    离子束光刻  ion beam lithography


    深紫外光刻  deep-UV lithography


    光刻机  mask aligner


    投影光刻机  projection mask aligner


    曝光  exposure


    接触式曝光法  contact exposure method


    接近式曝光法  proximity exposure method


    光学投影曝光法  optical projection exposure method


    电子束曝光系统  electron beam exposure system


    分步重复系统  step-and-repeat system


    显影  development


    线宽  linewidth


    去胶  stripping of photoresist


    氧化去胶  removing of photoresist by oxidation


    等离子[体]去胶  removing of photoresist by plasma


    刻蚀  etching


    干法刻蚀  dry etching


    反应离子刻蚀  reactive ion etching,  RIE


    各向同性刻蚀  isotropic etching


    各向异性刻蚀  anisotropic etching


    反应溅射刻蚀  reactive sputter etching


    离子铣  ion beam milling,又称“离子磨削”。


    等离子[体]刻蚀  plasma etching


    钻蚀  undercutting


    剥离技术  lift-off technology,又称“浮脱工艺”。


    终点监测  endpoint monitoring


    金属化  metallization


    互连  interconnection


    多层金属化  multilevel metallization


    电迁徙  electromigration


    回流  reflow


    磷硅玻璃  phosphorosilicate glass


    硼磷硅玻璃  boron-phosphorosilicate glass


    钝化工艺  passivation technology


    多层介质钝化  multilayer dielectric passivation


    划片  scribing


    电子束切片  electron beam slicing


    烧结  sintering


    印压  indentation


    热压焊  thermocompression bonding


    热超声焊  thermosonic bonding


    冷焊  cold welding


    点焊  spot welding


    球焊  ball bonding


    楔焊  wedge bonding


    内引线焊接  inner lead bonding


    外引线焊接  outer lead bonding


    梁式引线  beam lead


    装架工艺  mounting technology


    附着  adhesion


    封装  packaging


    金属封装  metallic packaging


    陶瓷封装  ceramic packaging


    扁平封装  flat packaging


    塑封  plastic package


    玻璃封装  glass packaging


    微封装  micropackaging,又称“微组装”。


    管壳  package


    管芯  die


    引线键合  lead bonding


    引线框式键合  lead frame bonding


    带式自动键合  tape automated bonding, TAB


    激光键合  laser bonding


    超声键合  ultrasonic bonding


    红外键合  infrared bonding

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    微电子辞典大集合

    (按首字母顺序排序)


    A


    Abrupt junction 突变结

    Accelerated testing 加速实验 

    Acceptor 受主 

    Acceptor atom 受主原子 

    Accumulation 积累、堆积 

    Accumulating contact 积累接触 

    Accumulation region 积累区 

    Accumulation layer 积累层 

    Active region 有源区 

    Active component 有源元 

    Active device 有源器件 

    Activation 激活 

    Activation energy 激活能 

    Active region 有源(放大)区 

    Admittance 导纳 

    Allowed band 允带 

    Alloy-junction device

    合金结器件 Aluminum(Aluminium) 铝 

    Aluminum – oxide 铝氧化物 

    Aluminum passivation 铝钝化 

    Ambipolar 双极的

    Ambient temperature 环境温度 

    Amorphous 无定形的,非晶体的 

    Amplifier 功放 扩音器 放大器 

    Analogue(Analog) comparator 模拟比较器 Angstrom 埃 

    Anneal 退火 

    Anisotropic 各向异性的 

    Anode 阳极 

    Arsenic (AS) 砷 

    Auger 俄歇 

    Auger process 俄歇过程 

    Avalanche 雪崩 

    Avalanche breakdown 雪崩击穿 

    Avalanche excitation雪崩激发 

    Icrank   芯片排行榜

    B


    Background carrier 本底载流子 

    Background doping 本底掺杂 

    Backward 反向 

    Backward bias 反向偏置 

    Ballasting resistor 整流电阻 

    Ball bond 球形键合 

    Band 能带 

    Band gap 能带间隙 

    Barrier 势垒 

    Barrier layer 势垒层 

    Barrier width 势垒宽度 

    Base 基极 

    Base contact 基区接触 

    Base stretching 基区扩展效应 

    Base transit time 基区渡越时间 

    Base transport efficiency基区输运系数 

    Base-width modulation基区宽度调制 

    Basis vector 基矢 

    Bias 偏置 

    Bilateral switch 双向开关 

    Binary code 二进制代码

    Binary compound semiconductor 二元化合物半导体 

    Bipolar 双极性的 

    Bipolar Junction Transistor (BJT)双极晶体管 

    Bloch 布洛赫 

    Blocking band 阻挡能带 

    Blocking contact 阻挡接触 

    Body - centered 体心立方 

    Body-centred cubic structure 体立心结构 

    Boltzmann 波尔兹曼 

    Bond 键、键合 

    Bonding electron 价电子 

    Bonding pad 键合点 

    Bootstrap circuit 自举电路 

    Bootstrapped emitter follower 自举射极跟随器

    Boron 硼 

    Borosilicate glass 硼硅玻璃 

    Boundary condition 边界条件 

    Bound electron 束缚电子 

    Breadboard 模拟板、实验板 

    Break down 击穿 

    Break over 转折 

    Brillouin 布里渊 

    Brillouin zone 布里渊区 

    Built-in 内建的 

    Build-in electric field 内建电场 

    Bulk 体/体内 Bulk absorption 体吸收 

    Bulk generation 体产生 

    Bulk recombination 体复合 

    Burn - in 老化 

    Burn out 烧毁 

    Buried channel 埋沟 

    Buried diffusion region 隐埋扩散区 


    C


    Can 外壳 

    Capacitance 电容 

    Capture cross section 俘获截面 

    Capture carrier 俘获载流子 

    Carrier 载流子、载波

    Carry bit 进位位 

    Carry-in bit 进位输入 

    Carry-out bit 进位输出 

    Cascade 级联 

    Case 管壳 

    Cathode 阴极

    Center 中心 

    Ceramic 陶瓷(的) 

    Channel 沟道 

    Channel breakdown 沟道击穿

    Channel current 沟道电流 

    Channel doping 沟道掺杂 

    Channel shortening 沟道缩短 

    Channel width 沟道宽度 

    Characteristic impedance 特征阻抗 

    Charge 电荷、充电 

    Charge-compensation effects 电荷补偿效应 

    Charge conservation 电荷守恒 

    Charge neutrality condition 电中性条件 

    Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储 

    Chemmical etching 化学腐蚀法 

    Chemically-Polish 化学抛光 

    Chemmically-Mechanically Polish (CMP) 化学机械抛光 Chip 芯片 

    Chip yield 芯片成品率 

    Clamped 箝位 

    Clamping diode 箝位二极管 

    Cleavage plane 解理面 

    Clock rate 时钟频率 

    Clock generator 时钟发生器 

    Clock flip-flop 时钟触发器 

    Close-packed structure 密堆积结构 

    Close-loop gain 闭环增益

    Collector 集电极 

    Collision 碰撞 

    Compensated OP-AMP 补偿运放 

    Common-base/collector/emitter connection 共基极/集电极/发射极连接 

    Common-gate/drain/source connection 共栅/漏/源连接 

    Common-mode gain 共模增益 

    Common-mode input 共模输入 

    Common-mode rejection ratio (CMRR) 共模抑制比 

    Compatibility 兼容性 

    Compensation 补偿 

    Compensated impurities 补偿杂质 

    Compensated semiconductor 补偿半导体 

    Complementary Darlington circuit 互补达林顿电路 

    Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS) 

    互补金属氧化物半导体场效应晶体管 

    Complementary error function 余误差函数 

    Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试 /制 

    造 

    Compound Semiconductor 化合物半导体 

    Conductance 电导 

    Conduction band (edge) 导带(底) 

    Conduction level/state 导带态 

    Conductor 导体

    Conductivity 电导率 

    Configuration 组态

    Conlomb 库仑 

    Conpled Configuration Devices 结构组态 

    Constants 物理常数 

    Constant energy surface 等能面 

    Constant-source diffusion恒定源扩散 

    Contact 接触 

    Contamination 治污 

    Continuity equation 连续性方程

    Contact hole 接触孔 

    Contact potential 接触电势 

    Continuity condition 连续性条件 

    Contra doping 反掺杂 

    Controlled 受控的 

    Converter 转换器 

    Conveyer 传输器 

    Copper interconnection system 铜互连系统

    Couping 耦合 

    Covalent 共阶的 

    Crossover 跨交 

    Critical 临界的 

    Crossunder 穿交 

    Crucible坩埚 

    Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶 

    格 

    Current density 电流密度

    Curvature 曲率 

    Cut off 截止 

    Current drift/dirve/sharing 电流漂移/驱动/共享 

    Current Sense 电流取样 

    Curvature 弯曲 

    Custom integrated circuit 定制集成电路 

    Cylindrical 柱面的 

    Czochralshicrystal 直立单晶 

    Czochralski technique 切克劳斯基技术(Cz法直拉晶体J) 

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    D


    Dangling bonds 悬挂键 

    Dark current 暗电流 

    Dead time 空载时间 

    Debye length 德拜长度 

    De.broglie 德布洛意 

    Decderate 减速 

    Decibel (dB) 分贝 

    Decode 译码 

    Deep acceptor level 深受主能级 

    Deep donor level 深施主能级 

    Deep impurity level 深度杂质能级 

    Deep trap 深陷阱 

    Defeat 缺陷 

    Degenerate semiconductor 简并半导体 

    Degeneracy 简并度 

    Degradation 退化 

    Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度 

    Delay 延迟 Density 密度 

    Density of states 态密度 

    Depletion 耗尽 

    Depletion approximation 耗尽近似 

    Depletion contact 耗尽接触 

    Depletion depth 耗尽深度 

    Depletion effect 耗尽效应 

    Depletion layer 耗尽层 

    Depletion MOS 耗尽MOS 

    Depletion region 耗尽区 

    Deposited film 淀积薄膜 

    Deposition process 淀积工艺 

    Design rules 设计规则 

    Die 芯片(复数dice) 

    Diode 二极管 

    Dielectric 介电的 

    Dielectric isolation 介质隔离 

    Difference-mode input 差模输入 

    Differential amplifier 差分放大器 

    Differential capacitance 微分电容 

    Diffused junction 扩散结 

    Diffusion 扩散 

    Diffusion coefficient 扩散系数 

    Diffusion constant 扩散常数

    Diffusivity 扩散率 

    Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉 

    Digital circuit 数字电路 

    Dipole domain 偶极畴 

    Dipole layer 偶极层 

    Direct-coupling 直接耦合 

    Direct-gap semiconductor 直接带隙半导体 

    Direct transition 直接跃迁 

    Discharge 放电 

    Discrete component 分立元件 

    Dissipation 耗散 

    Distribution 分布 

    Distributed capacitance 分布电容 

    Distributed model 分布模型 

    Displacement 位移 Dislocation 位错 

    Domain 畴 Donor 施主 

    Donor exhaustion 施主耗尽 

    Dopant 掺杂剂 

    Doped semiconductor 掺杂半导体 

    Doping concentration 掺杂浓度 

    Double-diffusive MOS(DMOS)双扩散MOS. 

    Drift 漂移 Drift field 漂移电场 

    Drift mobility 迁移率 

    Dry etching 干法腐蚀 

    Dry/wet oxidation 干/湿法氧化

    Dose 剂量 

    Duty cycle 工作周期 

    Dual-in-line package (DIP) 双列直插式封装 

    Dynamics 动态 

    Dynamic characteristics 动态属性 

    Dynamic impedance 动态阻抗 


    E


    Early effect 厄利效应 

    Early failure 早期失效 

    Effective mass 有效质量 

    Einstein relation(ship) 爱因斯坦关系 

    Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器 

    Electrode 电极 

    Electrominggratim 电迁移 

    Electron affinity 电子亲和势 

    Electronic -grade 电子能 

    Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光 

    Electron gas 电子气 

    Electron-grade water 电子级纯水 

    Electron trapping center 电子俘获中心 

    Electron Volt (eV) 电子伏 

    Electrostatic 静电的

    Element 元素/元件/配件 

    Elemental semiconductor 元素半导体

    Ellipse 椭圆 

    Ellipsoid 椭球 

    Emitter 发射极 

    Emitter-coupled logic 发射极耦合逻辑

    Emitter-coupled pair 发射极耦合对 

    Emitter follower 射随器 

    Empty band 空带 

    Emitter crowding effect 发射极集边(拥挤)效应 

    Endurance test =life test 寿命测试 

    Energy state 能态 

    Energy momentum diagram 能量-动量(E-K)图 

    Enhancement mode 增强型模式 

    Enhancement MOS 增强性

    MOS Entefic (低)共溶的 

    Environmental test 环境测试 

    Epitaxial 外延的 

    Epitaxial layer 外延层 

    Epitaxial slice 外延片 

    Expitaxy 外延 

    Equivalent curcuit 等效电路 

    Equilibrium majority /minority carriers 平衡多数/少数载流子 

    Erasable Programmable ROM (EPROM)可搽取(编程)存储器 

    Error function complement 余误差函数 

    Etch 刻蚀 

    Etchant 刻蚀剂 

    Etching mask 抗蚀剂掩模 

    Excess carrier 过剩载流子 

    Excitation energy 激发能 

    Excited state 激发态 

    Exciton 激子 

    Extrapolation 外推法 

    Extrinsic 非本征的 

    Extrinsic semiconductor 杂质半导体 

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    F


    Face - centered 面心立方 

    Fall time 下降时间 

    Fan-in 扇入 

    Fan-out 扇出 

    Fast recovery 快恢复 

    Fast surface states 快界面态 

    Feedback 反馈 

    Fermi level 费米能级 

    Fermi-Dirac Distribution 费米-狄拉克分布 

    Femi potential 费米势 

    Fick equation 菲克方程(扩散) 

    Field effect transistor 场效应晶体管 

    Field oxide 场氧化层 

    Filled band 满带 

    Film 薄膜 

    Flash memory 闪烁存储器 

    Flat band 平带 

    Flat pack 扁平封装 

    Flicker noise 闪烁(变)噪声 

    Flip-flop toggle 触发器翻转 

    Floating gate 浮栅 

    Fluoride etch 氟化氢刻蚀 

    Forbidden band 禁带 

    Forward bias 正向偏置 

    Forward blocking /conducting正向阻断/导通 

    Frequency deviation noise频率漂移噪声 

    Frequency response 频率响应 

    Function 函数 


    G


    Gain 增益 Gallium-Arsenide(GaAs) 砷化钾 

    Gamy ray r 射线 

    Gate 门、栅、控制极 

    Gate oxide 栅氧化层 

    Gauss(ian) 高斯 

    Gaussian distribution profile 高斯掺杂分布

    Generation-recombination 产生-复合 

    Geometries 几何尺寸 

    Germanium(Ge) 锗 

    Graded 缓变的 

    Graded (gradual) channel 缓变沟道 

    Graded junction 缓变结 

    Grain 晶粒 

    Gradient 梯度 

    Grown junction 生长结 

    Guard ring 保护环 

    Gummel-Poom model 葛谋-潘 模型 

    Gunn - effect 狄氏效应 

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    H


    Hardened device 辐射加固器件 

    Heat of formation 形成热 

    Heat sink 散热器、热沉 

    Heavy/light hole band 重/轻 空穴带 

    Heavy saturation 重掺杂 

    Hell - effect 霍尔效应 

    Heterojunction 异质结 

    Heterojunction structure 异质结结构 

    Heterojunction Bipolar Transistor(HBT)异质结双极型晶体 

    High field property 高场特性 

    High-performance MOS.( H-MOS)高性能

    MOS. Hormalized 归一化 

    Horizontal epitaxial reactor 卧式外延反应器 

    Hot carrior 热载流子 

    Hybrid integration 混合集成 


    I


    Icrank   芯片排行榜

    Image - force 镜象力 

    Impact ionization 碰撞电离 

    Impedance 阻抗 

    Imperfect structure 不完整结构 

    Implantation dose 注入剂量 

    Implanted ion 注入离子 

    Impurity 杂质

    Impurity scattering 杂志散射 

    Incremental resistance 电阻增量(微分电阻)

    In-contact mask 接触式掩模 

    Indium tin oxide (ITO) 铟锡氧化物 

    Induced channel 感应沟道 

    Infrared 红外的 

    Injection 注入 

    Input offset voltage 输入失调电压 

    Insulator 绝缘体 

    Insulated Gate FET(IGFET)绝缘栅

    FET Integrated injection logic集成注入逻辑 

    Integration 集成、积分 

    Interconnection 互连 

    Interconnection time delay 互连延时 

    Interdigitated structure 交互式结构 

    Interface 界面 

    Interference 干涉 

    International system of unions国际单位制 

    Internally scattering 谷间散射 

    Interpolation 内插法 

    Intrinsic 本征的 

    Intrinsic semiconductor 本征半导体 

    Inverse operation 反向工作 

    Inversion 反型 

    Inverter 倒相器 

    Ion 离子

    Ion beam 离子束 

    Ion etching 离子刻蚀 

    Ion implantation 离子注入 

    Ionization 电离 

    Ionization energy 电离能 

    Irradiation 辐照 

    Isolation land 隔离岛 

    Isotropic 各向同性 

    Icrank   芯片排行榜


    J


    Junction FET(JFET) 结型场效应管 

    Junction isolation 结隔离 

    Junction spacing 结间距 

    Junction side-wall 结侧壁 


    L


    Latch up 闭锁 

    Lateral 横向的 

    Lattice 晶格 

    Layout 版图 

    Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟 

    /晶格缺陷/晶格畸变 

    Leakage current (泄)漏电流 

    Level shifting 电平移动 

    Life time 寿命 

    linearity 线性度 

    Linked bond 共价键 

    Liquid Nitrogen 液氮 

    Liquid-phase epitaxial growth technique 液相外延生长技术 

    Lithography 光刻 

    Light Emitting Diode(LED) 发光二极管 

    Load line or Variable 负载线 

    Locating and Wiring 布局布线 

    Longitudinal 纵向的 

    Logic swing 逻辑摆幅 

    Lorentz 洛沦兹 

    Lumped model 集总模型 


    M


    Majority carrier 多数载流子 

    Mask 掩膜板,光刻板 

    Mask level 掩模序号 

    Mask set 掩模组 

    Mass - action law质量守恒定律

    Master-slave D flip-flop主从D触发器 

    Matching 匹配 

    Maxwell 麦克斯韦 

    Mean free path 平均自由程 

    Meandered emitter junction梳状发射极结 

    Mean time before failure (MTBF) 平均工作时间 

    Megeto - resistance 磁阻 

    Mesa 台面 

    MESFET-Metal Semiconductor金属半导体FET 

    Metallization 金属化 

    Microelectronic technique 微电子技术 

    Microelectronics 微电子学 

    Millen indices 密勒指数 

    Minority carrier 少数载流子 

    Misfit 失配 

    Mismatching 失配 

    Mobile ions 可动离子 

    Mobility 迁移率 

    Module 模块 

    Modulate 调制 

    Molecular crystal分子晶体 

    Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管 

    Mos. Transistor(MOST )MOS. 晶体管 

    Multiplication 倍增 

    Modulator 调制 

    Multi-chip IC 多芯片IC 

    Multi-chip module(MCM) 多芯片模块 

    Multiplication coefficient倍增因子 

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    N


    Naked chip 未封装的芯片(裸片) 

    Negative feedback 负反馈 

    Negative resistance 负阻 

    Nesting 套刻 

    Negative-temperature-coefficient 负温度系数 

    Noise margin 噪声容限 

    Nonequilibrium 非平衡 

    Nonrolatile 非挥发(易失)性 

    Normally off/on 常闭/开 

    Numerical analysis 数值分析 


    O


    Occupied band 满带 

    Officienay 功率 

    Offset 偏移、失调 

    On standby 待命状态 

    Ohmic contact 欧姆接触 

    Open circuit 开路 

    Operating point 工作点 

    Operating bias 工作偏置 

    Operational amplifier (OPAMP)运算放大器 

    Optical photon =photon 光子 

    Optical quenching光猝灭 

    Optical transition 光跃迁 

    Optical-coupled isolator光耦合隔离器 

    Organic semiconductor有机半导体 

    Orientation 晶向、定向 

    Outline 外形 

    Out-of-contact mask非接触式掩模 

    Output characteristic 输出特性 

    Output voltage swing 输出电压摆幅 

    Overcompensation 过补偿 

    Over-current protection 过流保护 

    Over shoot 过冲 

    Over-voltage protection 过压保护 

    Overlap 交迭 

    Overload 过载 

    Oscillator 振荡器 

    Oxide 氧化物 

    Oxidation 氧化 

    Oxide passivation 氧化层钝化 

    P


    Package 封装

    Pad 压焊点 

    Parameter 参数 

    Parasitic effect 寄生效应 

    Parasitic oscillation 寄生振荡 

    Passination 钝化 

    Passive component 无源元件 

    Passive device 无源器件 

    Passive surface 钝化界面 

    Parasitic transistor 寄生晶体管 

    Peak-point voltage 峰点电压 

    Peak voltage 峰值电压 

    Permanent-storage circuit 永久存储电路 

    Period 周期 

    Periodic table 周期表 

    Permeable - base 可渗透基区 

    Phase-lock loop 锁相环

    Phase drift 相移 

    Phonon spectra 声子谱 

    Photo conduction 光电导

     Photo diode 光电二极管 

    Photoelectric cell 光电池 

    Photoelectric effect 光电效应 

    Photoenic devices 光子器件 

    Photolithographic process 光刻工艺 

    (photo) resist (光敏)抗腐蚀剂 

    Pin 管脚 

    Pinch off 夹断 

    Pinning of Fermi level 费米能级的钉扎(效应) 

    Planar process 平面工艺 

    Planar transistor 平面晶体管 

    Plasma 等离子体 

    Plezoelectric effect 压电效应 

    Poisson equation 泊松方程 

    Point contact 点接触 

    Polarity 极性 

    Polycrystal 多晶 

    Polymer semiconductor聚合物半导体 

    Poly-silicon 多晶硅 

    Potential (电)势 

    Potential barrier 势垒 

    Potential well 势阱 

    Power dissipation 功耗 

    Power transistor 功率晶体管 

    Preamplifier 前置放大器 

    Primary flat 主平面 

    Principal axes 主轴 

    Print-circuit board(PCB) 印制电路板 

    Probability 几率 

    Probe 探针 

    Process 工艺 

    Propagation delay 传输延时 

    Pseudopotential method 膺势发 

    Punch through 穿通 

    Pulse triggering/modulating 脉冲触发/调制Pulse 

    Widen Modulator(PWM) 脉冲宽度调制 

    Punchthrough 穿通 

    Push-pull stage 推挽级 

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    Q


    Quality factor 品质因子 

    Quantization 量子化 

    Quantum 量子 

    Quantum efficiency量子效应 

    Quantum mechanics 量子力学 

    Quasi – Fermi-level准费米能级 

    Quartz 石英 


    R


    Radiation conductivity 辐射电导率 

    Radiation damage 辐射损伤 

    Radiation flux density 辐射通量密度 

    Radiation hardening 辐射加固 

    Radiation protection 辐射保护 

    Radiative - recombination辐照复合 

    Radioactive 放射性 

    Reach through 穿通 

    Reactive sputtering source 反应溅射源 

    Read diode 里德二极管 

    Recombination 复合 

    Recovery diode 恢复二极管 

    Reciprocal lattice 倒核子 

    Recovery time 恢复时间 

    Rectifier 整流器(管) 

    Rectifying contact 整流接触 

    Reference 基准点 基准 参考点 

    Refractive index 折射率 

    Register 寄存器 

    Registration 对准 

    Regulate 控制 调整 

    Relaxation lifetime 驰豫时间 

    Reliability 可靠性 

    Resonance 谐振 

    Resistance 电阻 

    Resistor 电阻器 

    Resistivity 电阻率 

    Regulator 稳压管(器) 

    Relaxation 驰豫 

    Resonant frequency共射频率 

    Response time 响应时间 

    Reverse 反向的 

    Reverse bias 反向偏置 


    S


    Sampling circuit 取样电路 

    Sapphire 蓝宝石(Al2O3) 

    Satellite valley 卫星谷 

    Saturated current range电流饱和区 

    Saturation region 饱和区

    Saturation 饱和的 

    Scaled down 按比例缩小 

    Scattering 散射 

    Schockley diode 肖克莱二极管 

    Schottky 肖特基 

    Schottky barrier 肖特基势垒 

    Schottky contact 肖特基接触 

    Schrodingen 薛定厄 

    Scribing grid 划片格 

    Secondary flat 次平面 

    Seed crystal 籽晶 

    Segregation 分凝 

    Selectivity 选择性 

    Self aligned 自对准的 

    Self diffusion 自扩散 

    Semiconductor 半导体 

    Semiconductor-controlled rectifier 可控硅 

    Sendsitivity 灵敏度 

    Serial 串行/串联 

    Series inductance 串联电感 

    Settle time 建立时间 

    Sheet resistance 薄层电阻 

    Shield 屏蔽

    Short circuit 短路 

    Shot noise 散粒噪声

    Shunt 分流 

    Sidewall capacitance 

    边墙电容 Signal 信号 

    Silica glass 石英玻璃 

    Silicon 硅 

    Silicon carbide 碳化硅 

    Silicon dioxide (SiO2) 二氧化硅 

    Silicon Nitride(Si3N4) 氮化硅 

    Silicon On Insulator 绝缘硅 

    Siliver whiskers 银须 

    Simple cubic 简立方 

    Single crystal 单晶 

    Sink 沉 

    Skin effect 趋肤效应 

    Snap time 急变时间 

    Sneak path 潜行通路 

    Sulethreshold 亚阈的 

    Solar battery/cell 太阳能电池 

    Solid circuit 固体电路 

    Solid Solubility 固溶度 

    Sonband 子带 

    Source 源极 

    Source follower 源随器 

    Space charge 空间电荷 

    Specific heat(PT) 热 

    Speed-power product 速度功耗乘积 Spherical 球面的 

    Spin 自旋 Split 分裂 

    Spontaneous emission 自发发射 

    Spreading resistance扩展电阻 

    Sputter 溅射 Stacking fault 层错 

    Static characteristic 静态特性 

    Stimulated emission 受激发射 

    Stimulated recombination 受激复合 

    Storage time 存储时间 

    Stress 应力 

    Straggle 偏差 

    Sublimation 升华 

    Substrate 衬底 

    Substitutional 替位式的 

    Superlattice 超晶格 

    Supply 电源 Surface 表面 

    Surge capacity 浪涌能力 

    Subscript 下标 

    Switching time 开关时间 

    Switch 开关 


    T


    Tailing 扩展 

    Terminal 终端 

    Tensor 张量 Tensorial 张量的 

    Thermal activation 热激发 

    Thermal conductivity 热导率 

    Thermal equilibrium 热平衡 

    Thermal Oxidation 热氧化 

    Thermal resistance 热阻 

    Thermal sink 热沉 

    Thermal velocity 热运动 

    Thermoelectricpovoer 温差电动势率 

    Thick-film technique 厚膜技术 

    Thin-film hybrid IC薄膜混合集成电路 

    Thin-Film Transistor(TFT) 薄膜晶体 

    Threshlod 阈值 

    Thyistor 晶闸管 

    Transconductance 跨导 

    Transfer characteristic 转移特性 

    Transfer electron 转移电子 

    Transfer function 传输函数 Transient 瞬态的 

    Transistor aging(stress) 晶体管老化 

    Transit time 渡越时间 

    Transition 跃迁 

    Transition-metal silica 过度金属硅化物 

    Transition probability 跃迁几率 

    Transition region 过渡区 

    Transport 输运 Transverse 横向的 

    Trap 陷阱 Trapping 俘获 

    Trapped charge 陷阱电荷 

    Triangle generator 三角波发生器 

    Triboelectricity 摩擦电

     Trigger 触发 

    Trim 调配 调整 

    Triple diffusion 三重扩散 

    Truth table 真值表 

    Tolerahce 容差 

    Tunnel(ing) 隧道(穿) 

    Tunnel current 隧道电流 

    Turn over 转折 

    Turn - off time 关断时间 


    U


    Ultraviolet 紫外的 

    Unijunction 单结的 

    Unipolar 单极的 

    Unit cell 原(元)胞 

    Unity-gain frequency 单位增益频率 

    Unilateral-switch单向开关 


    V


    Vacancy 空位 Vacuum 真空 

    Valence(value) band 价带 Value band edge 价带顶 

    Valence bond 价键 Vapour phase 汽相 

    Varactor 变容管 Varistor 变阻器 

    Vibration 振动 Voltage 电压 


    W


    Wafer 晶片 

    Wave equation 波动方程 

    Wave guide 波导 

    Wave number 波数 

    Wave-particle duality 波粒二相性 

    Wear-out 烧毁 

    Wire routing 布线 

    Work function 功函数 

    Worst-case device 最坏情况器件 


    Y


    Yield 成品率  


    Z


    Zener breakdown 齐纳击穿 

    Zone melting 区熔法 

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